View NLSX3012MUTAG_4700454.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

NLSX3012 2-Bit 100 Mb/s Configurable Dual-Supply Level Translator
The NLSX3012 is a 2-bit configurable dual-supply bidirectional level translator without a direction control pin. The I/O VCC- and I/O VL-ports are designed to track two different power supply rails, VCC and VL respectively. The VCC supply rail is configurable from 1.3 V to 4.5 V while the VL supply rail is configurable from 0.9 V to (VCC - 0.4) V. This allows lower voltage logic signals on the VL side to be translated into higher voltage logic signals on the VCC side, and vice-versa. Both I/O ports are auto-sensing; thus, no direction pin is required. The Output Enable (EN) input, when Low, disables both I/O ports by putting them in 3-state. This significantly reduces the supply currents from both VCC and VL. The EN signal is designed to track VL.
Features
8 1 A L Y W G
http://onsemi.com MARKING DIAGRAMS
8 1 UDFN8 MU SUFFIX CASE 517AJ VA = Specific Device Code M = Date Code G = Pb-Free Package 8 SO-8 D SUFFIX CASE 751 SX3012 ALYW G G 1 VAM G
* Wide High-Side VCC Operating Range: 1.3 V to 4.5 V * * * * * *
Wide Low-Side VL Operating Range: 0.9 V to (VCC - 0.4) V High-Speed with 140 Mb/s Guaranteed Date Rate for VL > 1.8 V Low Bit-to-Bit Skew Overvoltage Tolerant Enable and I/O Pins Non-preferential Powerup Sequencing Small packaging: UDFN8, SO-8, Micro8 This is a Pb-Free Device
1
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package 8 Micro8 DM SUFFIX CASE 846A 1 3012 AYW G G
Typical Applications
* Mobile Phones, PDAs, Other Portable Devices * PC and Laptops
A Y W G
= Assembly Location = Year = Work Week = Pb-Free Package
ORDERING INFORMATION
Device NLSX3012MUTAG NLSX3012DR2G NLSX3012DMR2G Package Shipping UDFN8 3000/T ape & Reel (Pb-Free) SO-8 2500/T ape & Reel (Pb-Free) Micro8 4000/T ape & Reel (Pb-Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2009
December, 2009 - Rev. 1
1
Publication Order Number: NLSX3012/D
NLSX3012
LOGIC DIAGRAM
EN VL VCC GND
I/O VL1
I/O VCC1
I/O VL2
I/O VCC2
PIN ASSIGNMENTS
VL I/O VL1 I/O VL2 GND 1 2 3 4 UDFN8 (Top View) 8 7 6 5 VCC I/O VCC1 I/O VCC2 EN VL 1 I/O VL1 2 I/O VL2 3 GND 4 SOIC-8 (Top View) 8 7 6 5 VCC I/O VCC1 I/O VCC2 EN VL I/O VL1 I/O VL2 GND 1 2 3 4 Micro8 (Top View) 8 7 6 5 VCC I/O VCC1 I/O VCC2 EN
PIN ASSIGNMENT
Pins VCC VL GND EN I/O VCCn I/O VLn Description VCC Input Voltage VL Input Voltage Ground Output Enable I/O Port, Referenced to VCC I/O Port, Referenced to VL
FUNCTION TABLE
EN L H Operating Mode Hi-Z I/O Buses Connected
http://onsemi.com
2
NLSX3012
MAXIMUM RATINGS
Symbol VCC VL I/O VCC I/O VL VEN IIK IOK ICC IL IGND TSTG VCC Supply Voltage VL Supply Voltage VCC-Referenced DC Input/Output Voltage VL-Referenced DC Input/Output Voltage Enable Control Pin DC Input Voltage Input Diode Clamp Current Output Diode Clamp Current DC Supply Current Through VCC DC Supply Current Through VL DC Ground Current Through Ground Pin Storage Temperature Parameter Value -0.5 to +5.5 -0.5 to +5.5 -0.5 to (VCC + 0.3) -0.5 to (VL + 0.3) -0.5 to +5.5 -50 -50 $100 $100 $100 -65 to +150 VI < GND VO < GND Condition Unit V V V V V mA mA mA mA mA C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VL VEN VIO TA DI/DV VCC Supply Voltage VL Supply Voltage Enable Control Pin Voltage Bus Input/Output Voltage Operating Temperature Range Input Transition Rise or Rate VI, VIO from 30% to 70% of VCC; VCC = 3.3 V $ 0.3 V I/O VCC I/O VL Parameter Min 1.3 0.9 GND GND GND -40 0 Max 4.5 VCC - 0.4 4.5 4.5 4.5 +85 10 Unit V V V V C ns
VL +1.8V +3.6V
P One-Shot
VCC
VL +1.8 V System
NLSX3012
VCC +3.6 V System I/O VL N One-Shot I/O VCC
I/O1 I/O2 GND EN
I/O VL1
I/O VCC1
I/O1 I/O2 GND
I/O VL2 I/O VCC2 EN GND
P One-Shot
N One-Shot
Figure 1. Typical Application Circuit
Figure 2. Simplified Functional Diagram (1 I/O Line) (EN = 1)
http://onsemi.com
3
NLSX3012
DC ELECTRICAL CHARACTERISTICS
-405C to +855C Symbol VIHC VILC VIHL VILL VIH VIL VOHC VOLC VOHL VOLL Parameter I/O VCC Input HIGH Voltage I/O VCC Input LOW Voltage I/O VL Input HIGH Voltage I/O VL Input LOW Voltage Control Pin Input HIGH Voltage Control Pin Input LOW Voltage I/O VCC Output HIGH Voltage I/O VCC Output LOW Voltage I/O VL Output HIGH Voltage I/O VL Output LOW Voltage TA = +25C TA = +25C I/O VCC Source Current = 20 mA I/O VCC Sink Current = 20 mA I/O VL Source Current = 20 mA I/O VL Sink Current = 20 mA Test Conditions (Note 1) VCC (V) (Note 2) 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 VL (V) (Note 3) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) Min 0.8 * VCC - 0.8 * VL - 0.8 * VL - 0.8 * VCC - 0.8 * VL - Typ (Note 4) - - - - - - - - - - Max - 0.2 * VCC - 0.2 * VL - 0.2 * VL - 0.2 * VCC - 0.2 * VL Unit V V V V V V V V V V
1. Normal test conditions are VEN = 0 V, CIOVCC = 15 pF and CIOVL = 15 pF, unless otherwise specified. 2. VCC is the supply voltage associated with the high voltage port, and VCC ranges from +1.3 V to 4.5 V under normal operating conditions. 3. VL is the supply voltage associated with the low voltage port. VL must be less than or equal to (VCC - 0.4) V during normal operation. However, during startup and shutdown conditions, VL can be greater than (VCC - 0.4) V. 4. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25C. All units are production tested at TA = +25C. Limits over the operating temperature range are guaranteed by design.
http://onsemi.com
4
NLSX3012
POWER CONSUMPTION
Symbol IQ-VCC IQ-VL Parameter Test Conditions (Note 5) VCC (V) (Note 6) VL (V) (Note 7) -405C to +855C Min - - - Typ - - - Max 1.0 1.0 2.0 Unit mA mA
Supply Current from EN = VL; I/O VCCn = 0 V, I/O VLn = 0 V, 1.3 to 3.6 0.9 to (VCC - 0.4) VCC I/O VCCn = VCC or I/O VLn = VL and Io = 0 Supply Current from EN = VL; I/O VCCn = 0 V, I/O VLn = 0 V, 1.3 to 3.6 0.9 to (VCC - 0.4) VL I/O VCCn = VCC or I/O VLn = VL and Io = 0 EN = VL, I/O VCCn = 0 V, I/O VLn = 0 V, I/O VCCn = VCC or I/O VLn = (VCC - 0.2 V) and Io = 0 < (VCC - 0.2)
ITS-VCC
VCC Tristate Output Mode Supply Current VL Tristate Output Mode Supply Current I/O Tristate Output Mode Leakage Current Output Enable Pin Input Current
EN = 0 V
1.3 to 3.6 0.9 to (VCC - 0.4)
-
-
1.0
mA
ITS-VL
EN = 0 V EN = 0 V EN = 0 V EN = 0 V -
1.3 to 3.6 0.9 to (VCC - 0.4) VCC - 0.2 1.3 to 3.6 0.9 to (VCC - 0.4) VCC - 0.2 1.3 to 3.6 0.9 to (VCC - 0.4)
- - - - -
- - - - -
0.2 2.0 0.15 2.0 1.0
mA
IOZ
mA
IEN
mA
5. Normal test conditions are VEN = 0 V, CIOVCC = 15 pF and CIOVL = 15 pF, unless otherwise specified. 6. VCC is the supply voltage associated with the high voltage port, and VCC ranges from +1.3 V to 4.5 V under normal operating conditions. 7. VL is the supply voltage associated with the low voltage port. VL must be less than or equal to (VCC - 0.4) V during normal operation. However, during startup and shutdown conditions, VL can be greater than (VCC - 0.4) V. 8. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25C. All units are production tested at TA = +25C. Limits over the operating temperature range are guaranteed by design.
http://onsemi.com
5
NLSX3012
TIMING CHARACTERISTICS
-405C to +855C Symbol tR-VCC tF-VCC tR-VL tF-VL ZO-VCC ZO-VL Parameter I/O VCC Rise Time (Output = I/O_VCC) I/O VCC Falltime (Output = I/O_VCC) I/O VL Risetime (Output = I/O_VL) I/O VL Falltime (Output = I/O_VL) I/O VCC One-Shot Output Impedance I/O VL One-Shot Output Impedance CIOVCC = 15 pF Test Conditions (Note 9) CIOVCC = 15 pF CIOVCC = 15 pF CIOVL = 15 pF CIOVL = 15 pF VCC (V) (Note 10) 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 VL (V) (Note 11) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) Min Typ (Note 12) 0.7 0.5 1.0 0.6 30 30 4.5 12 Max 2.4 1.0 3.8 1.2 Unit ns ns ns ns W W ns
tPD_VL-VCC Propagation Delay (Output = I/O_VCC, tPHL, tPLH) tPD_VCC-VL Propagation Delay (Output = I/O_VL, tPHL, tPLH) tSK VL-VCC Channel-to-Channel Skew (Output = I/O_VCC)
CIOVL = 15 pF
1.3 to 4.5
0.9 to (VCC - 0.4)
3.0
7.2
ns
CIOVCC = 15 pF
1.3 to 4.5
0.9 to (VCC - 0.4)
0.2
0.3
nS
tSK_VCC-VL Channel-to-Channel Skew (Output = I/O_VL) MDR Maximum Data Rate
CIOVCC = 15 pF
1.3 to 4.5
0.9 to (VCC - 0.4)
0.2
0.3
nS
(Output = I/O_VCC, CIOVCC = 15 pF) (Output = I/O_VL, CIOVL = 15 pF)
1.3 to 4.5 > 2.2
0.9 to (VCC - 0.4) > 1.8
110 140
Mb/s
9. Normal test conditions are VEN = 0 V, CIOVCC = 15 pF and CIOVL = 15 pF, unless otherwise specified. 10. VCC is the supply voltage associated with the high voltage port, and VCC ranges from +1.3 V to 4.5 V under normal operating conditions. 11. VL is the supply voltage associated with the low voltage port. VL must be less than or equal to (VCC - 0.4) V during normal operation. However, during startup and shutdown conditions, VL can be greater than (VCC - 0.4) V. 12. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25C. All units are production tested at TA = +25C. Limits over the operating temperature range are guaranteed by design.
http://onsemi.com
6
NLSX3012
ENABLE / DISABLE TIME MEASUREMENTS
-405C to +855C Symbol tEN-VCC Parameter Turn-On Enable Time (Output = I/O_VCC, tpZH) Turn-On Enable Time (Output = I/O_VCC, tpZL) tEN-VL Turn-On Enable Time (Output = I/O_VL, tpZH) Turn-On Enable Time (Output = I/O_VL, tpZL) tDIS-VCC Turn-Off Disable Time (Output = I/O_VCC, tpHZ) Propagation Delay (Output = I/O_VCC, tPLZ) tDIS-VL Turn-Off Disable Time (Output = I/O_VL, tpHZ) Propagation Delay (Output = I/O_VL, tPLZ) Test Conditions (Note 13) CIOVCC = 15 pF CIOVL = 15 pF CIOVCC = 15 pF CIOVL = 15 pF CIOVCC = 15 pF CIOVL = 15 pF CIOVCC = 15 pF CIOVL = 15 pF VCC (V) (Note 14) 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 1.3 to 4.5 VL (V) (Note 15) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) 0.9 to (VCC - 0.4) Min Typ (Note 16) 150 130 95 75 175 140 180 160 Max 200 180 225 100 250 160 275 220 Unit ns ns ns ns ns ns ns ns
13. Normal test conditions are VEN = 0 V, CIOVCC = 15 pF and CIOVL = 15 pF, unless otherwise specified. 14. VCC is the supply voltage associated with the high voltage port, and VCC ranges from +1.3 V to 4.5 V under normal operating conditions. 15. VL is the supply voltage associated with the low voltage port. VL must be less than or equal to (VCC - 0.4) V during normal operation. However, during startup and shutdown conditions, VL can be greater than (VCC - 0.4) V. 16. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25 C. All units are production tested at TA = +25 C. Limits over the operating temperature range are guaranteed by design. NLSX3012 EN Source I/O VL I/O VCC CIOVCC I/O VL CIOVL Source I/O VL 90% 50% 10% tPD_VL-VCC I/O VCC 90% 50% 10% tF-VCC tR-VCC tRISE/FALL v 3 ns I/O VCC 90% 50% 10% tPD_VL-VCC tPD_VCC-VL I/O VL 90% 50% 10% tF-VL tR-VL tPD_VCC-VL tRISE/FALL v 3 ns NLSX3012 EN I/O VCC
VL
VCC
VL
VCC
Figure 3. Driving I/O VL Test Circuit and Timing
Figure 4. Driving I/O VCC Test Circuit and Timing
http://onsemi.com
7
NLSX3012
VCC R1 CL RL 2xVCC OPEN
PULSE GENERATOR RT
DUT
Test tPZH, tPHZ tPZL, tPLZ
Switch Open 2 x VCC
CL = 15 pF or equivalent (Includes jig and probe capacitance) RL = R1 = 50 kW or equivalent RT = ZOUT of pulse generator (typically 50 W)
Figure 5. Test Circuit for Enable/Disable Time Measurement
tR Input tPLH Output 90% 50% 10% 90% 50% 10% tR tPHL tF 50% VL GND HIGH IMPEDANCE 10% 90% VOL VOH HIGH IMPEDANCE
VCC GND
EN
tPZL Output 50% tPZH Output 50%
tPLZ
tF
tPHZ
Figure 6. Timing Definitions for Propagation Delays and Enable/Disable Measurement
http://onsemi.com
8
NLSX3012
IMPORTANT APPLICATIONS INFORMATION
Level Translator Architecture
The NLSX3012 auto sense translator provides bi-directional voltage level shifting to transfer data in multiple supply voltage systems. This device has two supply voltages, VL and VCC, which set the logic levels on the input and output sides of the translator. When used to transfer data from the VL to the VCC ports, input signals referenced to the VL supply are translated to output signals with a logic level matched to VCC. In a similar manner, the VCC to VL translation shifts input signals with a logic level compatible to VCC to an output signal matched to VL. The NLSX3012 consists of four bi-directional channels that independently determine the direction of the data flow without requiring a directional pin. The one-shot circuits are used to detect the rising or falling input signals. In addition, the one shots decrease the rise and fall time of the output signal for high-to-low and low-to-high transitions.
Input Driver Requirements
translator options for an application such as the I2C bus that requires pullup resistors.
Enable Input (EN)
The NLSX3012 has an Enable pin (EN) that provides tri-state operation at the I/O pins. Driving the Enable pin to a low logic level minimizes the power consumption of the device and drives the I/O VCC and I/O VL pins to a high impedance state. Normal translation operation occurs when the EN pin is equal to a logic high signal. The EN pin is referenced to the VL supply and has Over-Voltage Tolerant (OVT) protection.
Uni-Directional versus Bi-Directional Translation
Auto sense translators such as the NLSX3012 have a wide bandwidth, but a relatively small DC output current rating. The high bandwidth of the bi-directional I/O circuit is used to quickly transform from an input to an output driver and vice versa. The I/O ports have a modest DC current output specification so that the output driver can be over driven when data is sent to in the opposite direction. For proper operation, the input driver to the auto sense translator should be capable of driving 20 mA of peak output current with an output impedance less than 25 W. The bi-directional configuration of the translator results in both input stages being active for a very short time period. Although the peak current from the input signal circuit is relatively large, the average current is small and consistent with a standard CMOS input stage.
Output Load Requirements
The NLSX3012 can function as a non-inverting uni-directional translator. One advantage of using the translator as a uni-directional device is that each I/O pin can be configured as either an input or output. The configurable input or output feature is especially useful in applications such as SPI that use multiple uni-directional I/O lines to send data to and from a device. The flexible I/O port of the auto sense translator simplifies the trace connections on the PCB.
Power Supply Guidelines
The NLSX3012 is designed to drive CMOS inputs. Resistive pullup or pulldown loads of less than 50 kW should not be used with this device. The NLSX3373 or NLSX3378 open-drain auto sense translators are alternate
It is recommended that the VL supply should be less than or equal to the value of the VCC minus 0.4 V. The sequencing of the power supplies will not damage the device during the power up operation; however, the current consumption of the device will increase if VL exceeds VCC minus 0.4 V. In addition, the I/O VCC and I/O VL pins are in the high impedance state if either supply voltage is equal to 0 V. For optimal performance, 0.01 to 0.1 mF decoupling capacitors should be used on the VL and VCC power supply pins. Ceramic capacitors are a good design choice to filter and bypass any noise signals on the power supply voltage lines to the ground plane of the PCB. The noise immunity will be maximized by placing the capacitors as close as possible to the supply and ground pins, along with minimizing the PCB connection traces.
http://onsemi.com
9
NLSX3012
PACKAGE DIMENSIONS
UDFN8 1.8 x 1.2, 0.4P CASE 517AJ-01 ISSUE O
D 0.10 C
PIN ONE REFERENCE
AB L1 DETAIL A
NOTE 5
E
0.10 C
TOP VIEW (A3) A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. DIM A A1 A3 b b2 D E e L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF
0.05 C 0.05 C
e/2 (b2)
1 4
(L2)
8 5 8X b
BOTTOM VIEW
II
SIDE VIEW
A1
C
SEATING PLANE
e
DETAIL A 8X
L
MOUNTING FOOTPRINT SOLDERMASK DEFINED
0.10 0.05
M M
CAB C
NOTE 3
0.22
7X
0.66
8X
1.50 1 0.32 0.40 PITCH
DIMENSIONS: MILLIMETERS
http://onsemi.com
10
NLSX3012
PACKAGE DIMENSIONS
SO-8 CASE 751-07 ISSUE AJ
-X- A
8 5
B
1
S
4
0.25 (0.010)
M
Y
M
-Y- G
K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
C -Z- H D 0.25 (0.010)
M SEATING PLANE
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
NLSX3012
PACKAGE DIMENSIONS
Micro8t CASE 846A-02 ISSUE H
D
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A -- -- 1.10 -- -- 0.043 A1 0.05 0.08 0.15 0.002 0.003 0.006 b 0.25 0.33 0.40 0.010 0.013 0.016 c 0.13 0.18 0.23 0.005 0.007 0.009 D 2.90 3.00 3.10 0.114 0.118 0.122 E 2.90 3.00 3.10 0.114 0.118 0.122 e 0.65 BSC 0.026 BSC L 0.40 0.55 0.70 0.016 0.021 0.028 HE 4.75 4.90 5.05 0.187 0.193 0.199
HE
E
PIN 1 ID
e
b 8 PL 0.08 (0.003)
M
TB
S
A
S
-T- PLANE 0.038 (0.0015) A1
SEATING
A c L
SOLDERING FOOTPRINT*
8X
1.04 0.041
0.38 0.015
8X
3.20 0.126
4.24 0.167
5.28 0.208
6X
0.65 0.0256
SCALE 8:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca Sales Representative
http://onsemi.com
12
NLSX3012/D

▲Up To Search▲

Price & Availability of NLSX3012MUTAG

	To Download NLSX3012MUTAG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .